Xilence Thermal Paste X5 heat sink compound 5.15 W/m·K 2.5 g

Xilence Thermal Paste X5 heat sink compound 5.15 W/m·K 2.5 g


Today's shipping of your order still possible:17Std 15min
Product no.:
ZUB-XPTP.X5
GTIN/EAN:
4044953501074
Shipping time:*
Stock:
Only 15 pcs on stock
Manufacturer:
Xilence
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Product Features Xilence Thermal Paste X5 heat sink compound 5.15 W/m·K 2.5 g

  • Thermal Paste X5 High Performance, 2.5 g

Products description Xilence ZUB-XPTP.X5

Xilence X5 thermal paste was specifically designed for high-end processors. The very high thermal conductivity ensures for an efficient heat exchange and low temperatures! The paste works reliably at temperatures from -50 to +300°C therefore, it is particularly well suited for extreme overclocking. Since the X5 is not electrically conductive, there is no danger for the surrounding hardware! Contents: 2.5 g.

Features
Thermal conductivity:5.15 W/m·K
Product colour:Black, White
Thermal resistance:0.201 °C/W
Certification:CE
Weight & dimensions
Weight:2.5 g
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**Changes and errors excepted. Illustrations may differ from the original. Product images and information on technical product properties without guarantee.