Xilence ZUB-XPTP.X5 heat sink compound 5.15 W/m·K 3 g
Xilence ZUB-XPTP.X5 heat sink compound 5.15 W/m·K 3 g
Xilence ZUB-XPTP.X5 heat sink compound 5.15 W/m·K 3 g
Xilence ZUB-XPTP.X5 heat sink compound 5.15 W/m·K 3 g
Xilence ZUB-XPTP.X5 heat sink compound 5.15 W/m·K 3 g
Xilence ZUB-XPTP.X5 heat sink compound 5.15 W/m·K 3 g

Xilence ZUB-XPTP.X5 heat sink compound 5.15 W/m·K 3 g


Today's shipping of your order still possible:17Std 1min
Product no.:
XZ019
GTIN/EAN:
4044953501074
Shipping time:*
Stock:
Only 22 pcs on stock
Manufacturer:
Xilence
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Product Features Xilence ZUB-XPTP.X5 heat sink compound 5.15 W/m·K 3 g

  • Thermal Paste X5 High Performance, 2.5 g

Products description Xilence XZ019

Xilence X5 thermal paste was specifically designed for high-end processors. The very high thermal conductivity ensures for an efficient heat exchange and low temperatures! The paste works reliably at temperatures from -50 to +300°C therefore, it is particularly well suited for extreme overclocking. Since the X5 is not electrically conductive, there is no danger for the surrounding hardware! Contents: 2.5 g.

Features
Thermal conductivity:5.15 W/m·K
Product colour:Black, Red, White
Viscosity note:73 CPS
Thermal resistance:0.201 °C/W
Operating temperature (T-T):-30 - 280 °C
Certification:CE
Technical details
Sustainability certificates:RoHS
Weight & dimensions
Weight:3 g
Packaging data
Quantity per pack:1 pc(s)
Package width:120 mm
Package depth:20 mm
Package height:10 mm
* Applies to deliveries to Germany. Delivery times for other countries and information on the calculation of the delivery date, see here.
**Changes and errors excepted. Illustrations may differ from the original. Product images and information on technical product properties without guarantee.