Intel® Xeon® Processor Scalable Family, Single Socket P (LGA 3647) supported, CPU TDP support 205WIntel® C622 chipsetUp to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 8x DIMM slotsExpansion slots: 1 PCI-E 3.0 x16, 1 PCI-E 3.0 x16 (x16 || x8), 1 PCI-E 3.0 x8 (x0 || x8), 1 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8)2 10GbE LAN ports10 SATA3 (6Gbps) via C622I/O: 1 VGA, 2 COM, TPM header2 SuperDOM with built-in power5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 6 USB 2.0 (2 rear, 4 via headers)M.2 NGFF connector
Processor | |
Processor manufacturer: | Intel |
Processor thermal power (max): | 205 W |
Memory | |
Supported memory types: | DDR4-SDRAM |
Maximum internal memory: | 1000 GB |
Memory voltage: | 1.2 V |
ECC: | |
Supported memory clock speeds: | 1600,1866,2133,2400,2666 MHz |
Storage controllers | |
RAID levels: | 0, 5, 10 |
Internal I/O | |
USB 2.0 connectors: | 6 |
Rear panel I/O ports | |
USB 2.0 ports quantity: | 6 |
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity: | 5 |
VGA (D-Sub) ports quantity: | 1 |
COM ports quantity: | 2 |
Network | |
Wi-Fi: | |
Ethernet LAN: | |
Ethernet interface type: | 10 Gigabit Ethernet |
Features | |
Motherboard form factor: | ATX |
Expansion slots | |
PCI Express x16 (Gen 3.x) slots: | 1 |
BIOS | |
BIOS type: | UEFI AMI |
ACPI version: | 6.0 |
Processor special features | |
Trusted Platform Module (TPM): | |
Operational conditions | |
Storage temperature (T-T): | -40 - 70 °C |
Operating temperature (T-T): | 0 - 50 °C |
Operating relative humidity (H-H): | 8 - 90% |
Storage relative humidity (H-H): | 5 - 95% |
Logistics data | |
Harmonized System (HS) code: | 84733020 |
Weight & dimensions | |
Width: | 304.8 mm |
Depth: | 243.8 mm |
Other features | |
PCI Express x4 (Gen 3.x) slots: | 1 |
PCI Express x8 (Gen 3.x) slots: | 1 |
Supported DIMM module capacities: | 4GB, 8GB, 16GB, 32GB, 64GB, 128MB |
Number of DIMM slots: | 8 |