Product Features Spire SilverGrease heat sink compound 1.93 W/m·K 0.5 g
SP-700/0.5G, Applicable to micro processors (CPU) and graphic array processors (GPU)
Products description Spire SP-700/0.5G
Applicable to micro processors (CPU) and graphic array processors (GPU)
Features
Thermal conductivity:
1.93 W/m·K
Product colour:
Grey
Operating temperature (T-T):
-30 - 180 °C
Weight & dimensions
Weight:
0.5 g
Packaging data
Package weight:
0.5 g
* Applies to deliveries to Germany. Delivery times for other countries and information on the calculation of the delivery date, see here.
**Changes and errors excepted. Illustrations may differ from the original. Product images and information on technical product properties without guarantee.
