Servers and storage solutions based on Intel® Xeon® processors deliver an unmatched combination of performance and built-in capabilities to support virtualized data centers and next-generation private clouds that are flexible, efficient, cost-effective, and built to scale.
| Processor | |
| Processor family: | Intel® Xeon® E5 V2 Family |
| Processor cores: | 6 |
| Processor socket: | LGA 1356 (Socket B2) |
| Processor lithography: | 22 nm |
| Box: |  |
| Processor manufacturer: | Intel |
| Processor model: | E5-2430V2 |
| Processor base frequency: | 2.5 GHz |
| Processor operating modes: | 32-bit, 64-bit |
| Component for: | Server/workstation |
| Processor threads: | 12 |
| System bus rate: | 7.2 GT/s |
| Processor boost frequency: | 3 GHz |
| Processor cache: | 15 MB |
| Processor cache type: | L3 |
| Thermal Design Power (TDP): | 80 W |
| VID Voltage Range: | 0.65 - 1.30 V |
| Bus type: | QPI |
| Number of QPI links: | 1 |
| Memory bandwidth supported by processor (max): | 38.4 GB/s |
| Processor ARK ID: | 75785 |
| Memory | |
| Memory channels: | Triple-channel |
| Maximum internal memory supported by processor: | 384 GB |
| Memory types supported by processor: | DDR3-SDRAM |
| Memory clock speeds supported by processor: | 800,1066,1333,1600 MHz |
| ECC: | |
| Graphics | |
| On-board graphics card: |  |
| Features | |
| Execute Disable Bit: | |
| Idle States: | |
| Thermal Monitoring Technologies: | |
| Market segment: | Server |
| PCI Express slots version: | 3.0 |
| Scalability: | 2S |
| Embedded options available: | |
| Processor special features | |
| Intel® Hyper Threading Technology (Intel® HT Technology): | |
| Intel® Identity Protection Technology (Intel® IPT): | |
| Intel® Turbo Boost Technology: | 2.0 |
| Intel Flex Memory Access: | |
| Intel® Smart Cache: | |
| Intel® AES New Instructions (Intel® AES-NI): | |
| Enhanced Intel SpeedStep Technology: | |
| Intel Trusted Execution Technology: | |
| Intel VT-x with Extended Page Tables (EPT): | |
| Intel Demand Based Switching: | |
| Intel® Secure Key: | |
| Intel TSX-NI: | |
| Intel Virtualization Technology (VT-x): | |
| Intel Virtualization Technology for Directed I/O (VT-d): | |
| Operational conditions | |
| Tcase: | 76 °C |
| Packaging data | |
| Package width: | 42.5 mm |
| Package depth: | 45 mm |
| Other features | |
| Intel® Virtualization Technology (Intel® VT): | VT-d, VT-x |
