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Products description
| Processor | |
| Processor family: | Intel® Xeon® Gold |
| Processor cores: | 10 |
| Processor socket: | LGA 3647 (Socket P) |
| Processor lithography: | 14 nm |
| Box: | No |
| Cooler included: | No |
| Processor model: | 5115 |
| Processor base frequency: | 2.4 GHz |
| Processor operating modes: | 64-bit |
| Processor generation: | 1st Generation Intel® Xeon® Scalable |
| Component for: | Server/workstation |
| Processor series: | Intel Xeon Gold 5000 Series |
| Processor threads: | 20 |
| Processor boost frequency: | 3.2 GHz |
| Processor cache: | 13.75 MB |
| Processor cache type: | L3 |
| Thermal Design Power (TDP): | 85 W |
| Stepping: | H0 |
| Processor codename: | Skylake |
| Memory | |
| Memory channels: | Hexa-channel |
| Maximum internal memory supported by processor: | 768 GB |
| Memory types supported by processor: | DDR4-SDRAM |
| Memory clock speeds supported by processor: | 2666 MHz |
| ECC: | Yes |
| Graphics | |
| On-board graphics card: | No |
| Features | |
| Execute Disable Bit: | Yes |
| Market segment: | Server |
| Maximum number of PCI Express lanes: | 48 |
| PCI Express slots version: | 3.0 |
| Supported instruction sets: | AVX, AVX 2.0, AVX-512, SSE4.2 |
| Scalability: | S4S |
| Embedded options available: | No |
| Processor special features | |
| Intel® Hyper Threading Technology (Intel® HT Technology): | Yes |
| Intel® Turbo Boost Technology: | 2.0 |
| Intel® AES New Instructions (Intel® AES-NI): | Yes |
| Enhanced Intel SpeedStep Technology: | Yes |
| Intel Trusted Execution Technology: | Yes |
| Intel® Speed Shift Technology: | Yes |
| Intel VT-x with Extended Page Tables (EPT): | Yes |
| Intel TSX-NI: | Yes |
| Intel 64: | Yes |
| Intel Virtualization Technology (VT-x): | Yes |
| Intel Virtualization Technology for Directed I/O (VT-d): | Yes |
| Conflict-Free processor: | Yes |
| Intel Turbo Boost Max Technology 3.0: | No |
| Intel® Optane Memory Ready: | No |
| Intel® vPro Platform Eligibility: | Yes |
| Operational conditions | |
| Tcase: | 76 °C |
| Weight & dimensions | |
| Processor package size: | 76.0 x 56.5 mm |
Product Safety Information
Responsible Person in the EU:
Fujitsu Technology Solutions GmbH Mies-van-der-Rohe-Straße 8 80807 München Deutschland cic@fujitsu.com
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