Cooler Master HTK-002 heat sink compound Thermal paste 4.5 W/m·K
Cooler Master HTK-002 heat sink compound Thermal paste 4.5 W/m·K
Cooler Master HTK-002 heat sink compound Thermal paste 4.5 W/m·K
Cooler Master HTK-002 heat sink compound Thermal paste 4.5 W/m·K
Cooler Master HTK-002 heat sink compound Thermal paste 4.5 W/m·K
Cooler Master HTK-002 heat sink compound Thermal paste 4.5 W/m·K
Cooler Master HTK-002 heat sink compound Thermal paste 4.5 W/m·K
Cooler Master HTK-002 heat sink compound Thermal paste 4.5 W/m·K

Cooler Master HTK-002 heat sink compound Thermal paste 4.5 W/m·K


Product no.:
HTK-002-U1-GP
GTIN/EAN:
4719512002940
Shipping time:*
Stock:
Only 6 pcs on stock
Manufacturer:
Cooler Master
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Product Features Cooler Master HTK-002 heat sink compound Thermal paste 4.5 W/m·K

  • 0.8 °C/W, 550 volts/mil, 21.7 kV/mm

Products description Cooler Master HTK-002-U1-GP

Cooler Master HTK-002 thermally conductive compounds are grease-like silicone materials, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 177oC (350oF), maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device.

Features
Type:Thermal paste
Thermal conductivity:4.5 W/m·K
Product colour:White
Thermal resistance:0.8 °C/W
Specific gravity:2.37 g/cm³
Packaging data
Quantity per pack:1 pc(s)
Package width:102 mm
Package depth:171 mm
Package height:40 mm
* Applies to deliveries to Germany. Delivery times for other countries and information on the calculation of the delivery date, see here.
**Changes and errors excepted. Illustrations may differ from the original. Product images and information on technical product properties without guarantee.